芯片技术论文汇总

Chip Industry Technical Paper Roundup: Nov. 3

AI 摘要

近期半导体工程库新增的技术论文涵盖了米级量子互连、2.5D/3D GPU集成与嵌入式排放、可证明安全的内存依赖预取、路由感知模拟布局、AI增强的倒芯片缺陷检测以及用于神经网络向量存储的叠加PCM等主题。

正文 · 清洗整理版

Meter-scale quantum interconnects between large quantum processors. IBM Research. Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI. imec, Vrije Universiteit Brussel. SecDMP: Provably Secure Data Memory-Dependent Prefetching.

KU Leuven, EURECOM. APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement. UT Austin.

AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging Materials Center Leoben, PVA TePla, ASE. Superposed analog memory for vector storage in neural networks. IBM Research Europe.

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